Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: 3D metrology spanning the chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging.
Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues.
Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient.
Job Summary & Responsibilities
Panel Application Engineer/ Technical Liaison to US Advanced Packaging Customers
Reporting to the IBU Applications Manager for Panel Application Studies and to the IBU -GM for the Advanced Packaging Technical Liaison to Intel
Based at Onto's Wilmington, MA facility with occasional (~15%) travel to Intel sites, primarily, but not limited to Hillsboro OR, Chandler AZ and Malaysia.
Product Portfolio
·Inspection - Firefly panel inspection system, to include Discover Review and on tool ADC
· Awareness of Lithography Stepper – for advanced packaging applications and Step Fast
Responsibilities and Duties
Coordinate application studies for panel inspection with the field sales team and Technical Account Managers.
Performs the application studies on the Firefly panel inspection system, both independently and with the customer attending to observe the study.
Demonstrate the systems capabilities in detecting defects of interest and optimizing system throughput.
Present application study results to customers demonstrating our systems capabilities.
Act as the technical liaison to Intel for Advanced Packaging initiatives.
Works with both the Onto onsite Service/Applications teams and the Intel Global Account Manager to relay technical requirements - from Intel to Onto and vice versa.
Qualifications
Minimum requirements:
Highly driven, self-sufficient, well organized
Good interpersonal skills
Willingness to travel ~15% time both domestically and internationally.
Strong presentation and communication skills
3-15 years experience working in semiconductor manufacturing industry preferably in Panels/Advanced Packaging
Strong Microsoft Office product knowledge
Experience with inspection equipment desirable
Good knowledge of semiconductor manufacturing processes proven through similar application support or process engineering roles
University degree or relevant experience.
Onto Innovation Inc.
offers competitive salaries and a generous benefits package, including health/dental/vision/life/disability, PTO, 401K plan with employer match, and an Employee Stock Ownership Program (ESOP) along with health & wellness initiatives.
We provide a collaborative working environment along with resources, and state-of-the-art tools & equipment to promote success; and a welcoming, inclusive corporate culture where individuals are recognized for their contributions.
Onto Innovation Inc.
is an Equal Opportunity Employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, gender, sexual orientation, national origin, genetic information, age, disability, veteran status, or any other legally protected basis.
For positions requiring access to technical data, Onto Innovation Inc.
, Inc.
may have to obtain export licensing approval from the U.
S.
Department of Commerce - Bureau of Industry and Security and/or the U.
S.
Department of State - Directorate of Defense Trade Controls.
As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.
S.
C.
1324b(a)(3) – may have to go through an export licensing review process.
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